Design and Implementation of a 6LoWPAN-Based Lightweight Wireless Embedded Internet Platform for IoT Applications,ERICDATA高等教育知識庫
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篇名
Design and Implementation of a 6LoWPAN-Based Lightweight Wireless Embedded Internet Platform for IoT Applications
並列篇名
Design and Implementation of a 6LoWPAN-Based Lightweight Wireless Embedded Internet Platform for IoT Applications
作者 Sendren Sheng-Dong XuI Gede Darco PancevMuhammad Yeza Baihaqi
英文摘要

The Internet of Things (IoT) plays an important role in the revolution of the Internet with the rise of Industry 4.0. It is closely related to low-power embedded devices, which have not been entirely IP-enabled until now. The 6LoWPAN (acronym of IPv6 over low-power wireless personal area networks) is an IPv6 protocol for Wireless Embedded Internet. It can help enable even the minimum embedded systems with limited processing capabilities to participate in the IoT. This study investigates a reliable way of future IoT networking by designing and implementing a 6LoWPAN-based lightweight Wireless Embedded Internet platform, named Lowvy (abbreviated from low-power wireless connectivity). Lowvy is characterized by low power consumption, constrained memory, small size, a low-cost IPv6-enabled wireless embedded device, and a constrained application protocol (CoAP). We did different application experiments to test the performance of the platform in terms of received signal strength indicator (RSSI), power consumption, sensor integration, and internet integration application with 6LoWPAN. Comparing Lowvy with other wireless embedded IoT platforms, Lowvy is less expensive and more compact. Moreover, Lowvy has a powerful performance in terms of signal strength for a longer wireless distance transmission of about 25 to 30 meters and has a lower power consumption of 41.60 milliwatts.

 

起訖頁 323-332
關鍵詞 Internet of Things (IoT)IPv6 over low-power wireless personal area networks (6LoWPAN)low-power wireless connectivity (Lowvy)lightweight wireless embedded devicesWireless Embedded Internet
刊名 網際網路技術學刊  
期數 202303 (24:2期)
出版單位 台灣學術網路管理委員會
DOI 10.53106/160792642023032402011   複製DOI
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